Online Submission


 English (国外作者投稿链接)

Important Dates

Full Paper Submission Date

Registration Deadline

Final Paper Submission Date

July 18, 2024

 August 1, 2024

August 10, 2024

Welcome to ICAMIM 2024

As the material precursor for the emerging strategic industries, advanced materials have become the key focus and core technology of international competition. Meanwhile, the development of advanced materials and their corresponding technologies and industries has also been regarded as a “national development strategy” for the world’s leading countries and has gradually developed into a new “trump card” in the game between countries. Intelligent manufacturing, with the most technological innovation value, requires a high level of knowledge and technology in the equipment manufacturing industry and a high degree of integration and application of core technologies, new materials, and components. What's more, intelligent manufacturing embodies the comprehensive strength of scientific and technological innovation ability, manufacturing technology level, and international competitiveness.

The aim of the 2024 5th International Conference on Advanced Materials and Intelligent Manufacturing, which is to be held in Guangzhou, China, from August 16–18, 2024, is to share the latest research progress, especially on steel in the structural part of modern cars, and to strengthen the exchange of advanced materials and intelligent manufacturing technologies in various countries around the world. This conference will provide high-level technical exchange platforms to jointly promote continuous innovation in the field of advanced materials and intelligent manufacturing for worldwide experts, scholars, science and technology workers, entrepreneurs, and other relevant personnel engaging in advanced materials and intelligent manufacturing research.

We are warmly welcoming experts, scholars, and scientific and technological workers in this area to participate in this international academic exchange activity in the field of advanced materials and intelligent manufacturing technology.


Call for Papers

hot.gif The topics of interest include, but are not limited to:

Advanced materials

01)Non-ferrous metal materials

02)Steel polymer material


04)Micro/nano materials

05)Optical/electronic/magnetic materials

06)New feature materials

Intelligent manufacturing

01)Biomimicry mechanisms

02)Integrated manufacturing systems

03)Industrial and manufacturing systems analysis and decision-making

04)Digital manufacturing

05)Modeling and design

06)Intelligent systems

07)Intelligent mechatronics

08)Micromachining technology

09)Advanced manufacturing technology

10)Recycling and remanufacturing

Information Technology and Electronics

01)Signal processing

02)Sensors and the Internet of Things

03)Mobile computing vs. edge computing

04)Wireless networks and information systems

05)5G and 6G

06)Circuits and systems

07)Imaging and machine vision technology

08)Photoelectric signal and information processing


01)Theory and Algorithms

02)Machine learning/reinforcement learning

03)VLSI and Computer Architecture

04)Artificial Intelligence Database


All papers, both invit
ed and contributed, will be reviewed by two or three experts from the committees. After a careful reviewing process, all accepted papers of ICAMIM 2024 will be published in theJournal of Physics: Conference Series (ISSN:1742-6596), and it will be submitted toEI Compendex and Scopus for indexing.

ICAMIM 2020 丨EI Compendex

ICAMIM 2021 丨EI Compendex

ICAMIM 2022 丨EI Compendex

ICAMIM 2023 丨EI Compendex

Note: All submitted articles should report original results, experimental or theoretical, not previously published or being under consideration for publication elsewhere. Articles submitted to the conference should meet these criteria. We firmly believe that ethical conduct is the most essential virtue of any academics. Hence, any act of plagiarism or other misconduct is totally unacceptable and cannot be tolerated.

About SCI journals

*Journal Name: 

High Temperature Materials and Processes (ISSN:0334-6455, E-ISSN:2191-0324)

*Journal Introduction: 

High Temperature Materials and Processes offers an international publication forum for new ideas, insights, and results related to high-temperature materials and processes in science and technology. The journal publishes original research papers, short communications, reviews articles, Topical and Special Issues papers of high-temperature materials and processes. 

*Abstracted and indexed in:

-Science Citation Index Expanded (SCIE) 

-Ei Compendex

-Scopus (CiteScore)

Manuscripts recommended by AEIC may have the opportunity to enjoy: 

1.50% off - Article Processing Charge (APC);

2.Rapid pre-review by journal editors.

Should you have any questions on submission, please contact Conference Secretariat.

Welcome to submit your manuscripts or/and the expanded version of conference papers to High Temperature Materials and Processes!

Supported By





Conference Info.



All the attendees must register in advance in order to participate in conference.

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Please submit your full paper/abstract to us via the Electronic Submission System.

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All papers will be reviewed by two or three expert reviewers.

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Topics of interest for submission include, but are not limited to ...

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Registration Details

1. Registration fees include conference proceedings, lunches, souvenirs and attending all technical sessions.

2. The registration fee does not include:

• Accommodation

• Visa application fee

• Transportation fare

3. At least one author for each accepted final paper must pre-register.

4. Completed registrations will be acknowledged by the Organizing Committee within 2-5 workdays after receiving your payment.

5. If you cannot attend the conference due to some reasons, we will post the print proceedings to you together with the payment receipt/Fapiao.

Registration Fee



Regular Registration for Paper (5-6 pages)

550 USD / 3800 CNY paper (5-6 pages)

Extra Pages (Begin at Page 7)

50 USD / 400 CNY extra page

Attendees without a Submission

210 USD / 1500 CNY person

Attendees without a Submission (Groups)

180 USD / 1200 CNY person (≥ 3 person)

Purchase Extra Proceedings/Journal copies

90 USD / 600 CNY book





(Aug. 16, 2024)

Onsite Registration


(Aug. 17, 2024)

Opening Ceremony + Keynote Speech


(Aug. 17, 2024)



(Aug. 17, 2024)

Oral Presentations


(Aug. 17, 2024)



(Aug. 18, 2024)

Academic tour